Hexaspec

Hexaspec

Tianshu Zhai Ph.D. ‘25, Materials Science & NanoEngineering | Chen-Yang Lin Ph.D. ‘26, Materials Science & NanoEngineering

HEXAspec provides innovative inorganic fillers and molding compounds for next-gen chip packaging, enhancing chip protection, lowering cooling costs, and unlocking future computing power.

Website | LinkedIn

Sector

Semiconductors

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Lilie Connection

Rice Innovation Fellows, Summer Venture Studio

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Press Links

HEXAspec Selected for Inaugural Tesoro AI + Semiconductor Accelerator Partnered with Amkor, Cadence, and TSMC

HEXAspec Lands $500K NSF Research Grant to Boost Chip Sustainability 

HEXAspec Wins 1st Place at TEX-E Startup Pitch at 2025 CERAWeek